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High Precision UV+CO2 Laser Drilling Equipment for Micro Hole Processing in Electronic Circuits

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Product Description

🚀 Overview
Basic Information
OEM & ODMAccepted
CertificateCE, ISO9001
Transport PackageWooden Case
Specification2100mm x 2300mm x 1900mm
OriginChina
Production Capacity100 sets/Month
Packaging & Delivery
Package Size230.00cm * 250.00cm * 230.00cm
Package Gross Weight3000.000kg
📋 Product Description

This UV+CO2 Laser Drilling Machine is engineered for high-precision micro blind hole and through-hole processing in PCB and electronic circuit manufacturing. Combining nanosecond UV, picosecond UV, and CO2 laser technologies, it delivers exceptional accuracy, efficiency, and environmental friendliness, ideal for demanding industrial applications.

UV+CO2 Laser Drilling Equipment
⚙️ Product Parameters
Parameter Specification
Laser TypeNanosecond UV, Picosecond UV, CO2 laser
Processing Area550mm × 650mm (Customizable)
Machine Size2100mm × 2300mm × 1900mm
Processing Accuracy±0.02mm
Electric Power Loading6.6KW
Machine Weight3000KG
Environment RequirementsTemperature: 22°C±2; Humidity: 30%~60%
⭐ Our Advantages
1
No Pre/Post-Treatment Eliminates the need for plasma treatment, ensuring superior quality and enhanced environmental sustainability by avoiding blackening/browning.
2
Breakthrough in Drilling Limits Ultrafast laser technology overcomes size restrictions of traditional CO2 drilling, enabling precise micro-hole processing.
3
High-Precision Zonal Processing Advanced mechanical design and accurate positioning recognition support high-precision zone-based operations.
4
Specialized for Micro Blind Holes Equipped with high-speed scanning galvanometers and a dedicated control system optimized for micro manufacturing.
Laser Drilling Precision
📦 Packaging & Shipping
Production Process
Packing Details: Standard 1PCS per Wooden Case for maximum protection.

Shipping Method: Shipping by sea is recommended due to heavy weight. International express is available for urgent requirements.

Delivery Time: - Standard goods: 30-45 days after deposit.
- Customized goods: 45-60 days after deposit.
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❓ FAQ
1. What are the key advantages of this laser drilling machine?
The machine combines nanosecond UV, picosecond UV, and CO2 technologies. It eliminates the need for plasma treatment (no blackening/browning) and achieves high precision (±0.02mm) for micro-hole processing.
2. Which industries can benefit from this equipment?
It is widely used in PCB manufacturing, consumer electronics, semiconductors, glass processing, solar energy, and new energy power batteries.
3. Can the processing area be customized?
Yes. While the standard area is 550mm × 650mm, we provide customizable solutions to fit specific production needs and board sizes.
4. Is the machine environmentally friendly?
Absolutely. Since it requires no blackening/browning chemical treatments and generates less waste than mechanical drilling, it significantly reduces environmental impact.
5. What kind of technical support do you provide?
We offer comprehensive support including pre-sales consultation, on-site installation, staff training, and 24/7 remote technical assistance.
6. How does laser drilling compare to mechanical drilling?
Laser drilling provides much higher precision (±0.02mm vs 0.05mm+), faster speeds for micro-holes (<0.1mm), and prevents damage to delicate materials like thin copper foils.

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